Companies / Markets

 
Steve Marsh, CBO at SmartKem (photo: SmartKem)

SmartKem achieves major milestone in commercialisation programme


Companies / Markets

SmartKem (Manchester, UK), a chemical specialist and leader in the design and development of semiconductors for electronic displays, has signed a landmark deal which is expected to lead to full commercialisation of its organic thin film transistor (OTFT) technology.

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SolarWindow and Raynergy collaborate to pursue the high-volume production of electricity-generating windows (photo: Raynergy Tek)

SolarWindow announces collaboration with Raynergy Tek


Companies / Markets

SolarWindow Technologies, Inc. (Columbia, Maryland) has advanced collaboration with one of the world’s leading suppliers of organic photovoltaic materials, used by SolarWindow to coat ordinary glass and turn it into electricity-generating windows. The collaboration with Raynergy Tek supports the company’s pursuit of high-volume production, increased power output, and enhanced transparency of SolarWindow products for tall towers and skyscrapers.

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An IMSE solution from TactoTek (photo: TactoTek)

IMSE leader TactoTek secures US$23M in funding


Companies / Markets

TactoTek (Oulu, Finland), a leading developer of injection moulded structural electronics (IMSE) solutions, announced that it has closed $23M in funding. The investment round attracted new strategic investors, Ascend Capital Partners, Nanogate, and Plastic Omnium, continuing participation from prior investors, including Conor Venture Partners and Faurecia Ventures, as well as debt instruments and grants.

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NextFlex has proven the robustness of its FHE manufacturing process (photo: NextFlex)

NextFlex proves manufacturability of flexible hybrid electronics process


Companies / Markets

NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute (San Jose, California), announced it has successfully proven the robustness of the FHE manufacturing process, producing multiple functional samples of a flexible Arduino system. As part of the Flexible Arduino Microcontroller Project, NextFlex redesigned a device typically built on a rigid printed circuit board (PCB)—by printing and attaching thin bare die on a flexible substrate while maintaining the performance associated with traditional packaged ICs. This achievement is ultimately intended to help realise FHE’s enormous potential for creating ubiquitous IoT and sensor products for consumer, commercial, and military applications.

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Novaled invests in the future at the new company headquarters in Dresden (photo: Novaled)

Novaled invests in material development capacities


Companies / Markets

The year 2018 will be a milestone for Novaled in the company's history, because the move to the new premises in Dresden, Germany, will be kicked off in the second half of the year.
On the 10 200m² plot, the interior construction of the buildings is currently in full swing. The monument protected historic mill with prestigious office space and the R&D plant with research areas, clean rooms of classes ISO5 and ISO7 as well as laboratories have a combined floor area of 6160m².

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