News (flexible electronics)

Testing requirements for smart packaging: Ensuring quality, safety and functionality

Doro Mergner of MSWtech, Nuremberg, Germany, takes a look at the essential testing requirements that are critical when using flexible electronics in packaging.

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LOPEC 2024: The Highlights for Flexible and Printed Electronics

Printed electronics is both a key and a cross-sectional technology, as this year's LOPEC will demonstrate with numerous applications and presentations. LOPEC takes place in Munich from March 5-7, 2024.

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