Companies / Markets - News - OPE Journal - Organic & Printed Electronics

An Aerosol Jet printer from Optomec (photo: Optomec)

Optomec partners with Tesscorn to expand additive manufacturing market in India

Wednesday 21 February 2018
Companies / Markets

Optomec (Albuqerque, New Mexico), a leading global supplier of production grade additive manufacturing systems for 3D printed metals and 3D printed electronics, recently announced it signed a distribution agreement with Tesscorn Nano Science, Inc. to expand sales of its solutions into India. Tesscorn is a leading distributor of integrated products, services, and support to the research and development community in India including defence, aerospace, automotive, military forces and universities.

Steve Marsh, CBO at SmartKem (photo: SmartKem)

SmartKem achieves major milestone in commercialisation programme

Tuesday 20 February 2018
Companies / Markets

SmartKem (Manchester, UK), a chemical specialist and leader in the design and development of semiconductors for electronic displays, has signed a landmark deal which is expected to lead to full commercialisation of its organic thin film transistor (OTFT) technology.

SolarWindow and Raynergy collaborate to pursue the high-volume production of electricity-generating windows (photo: Raynergy Tek)

SolarWindow announces collaboration with Raynergy Tek

Friday 16 February 2018
Companies / Markets

SolarWindow Technologies, Inc. (Columbia, Maryland) has advanced collaboration with one of the world’s leading suppliers of organic photovoltaic materials, used by SolarWindow to coat ordinary glass and turn it into electricity-generating windows. The collaboration with Raynergy Tek supports the company’s pursuit of high-volume production, increased power output, and enhanced transparency of SolarWindow products for tall towers and skyscrapers.

An IMSE solution from TactoTek (photo: TactoTek)

IMSE leader TactoTek secures US$23M in funding

Thursday 15 February 2018
Companies / Markets

TactoTek (Oulu, Finland), a leading developer of injection moulded structural electronics (IMSE) solutions, announced that it has closed $23M in funding. The investment round attracted new strategic investors, Ascend Capital Partners, Nanogate, and Plastic Omnium, continuing participation from prior investors, including Conor Venture Partners and Faurecia Ventures, as well as debt instruments and grants.

NextFlex has proven the robustness of its FHE manufacturing process (photo: NextFlex)

NextFlex proves manufacturability of flexible hybrid electronics process

Tuesday 13 February 2018
Companies / Markets

NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute (San Jose, California), announced it has successfully proven the robustness of the FHE manufacturing process, producing multiple functional samples of a flexible Arduino system. As part of the Flexible Arduino Microcontroller Project, NextFlex redesigned a device typically built on a rigid printed circuit board (PCB)—by printing and attaching thin bare die on a flexible substrate while maintaining the performance associated with traditional packaged ICs. This achievement is ultimately intended to help realise FHE’s enormous potential for creating ubiquitous IoT and sensor products for consumer, commercial, and military applications.