PulseForge, Inc. (Austin, Texas) has announced the launch of its latest product, the PD 300 SA semi-automated photonic debonding tool. Designed to enable semiconductor advanced packaging for R&D and low-volume customers, this cutting-edge tool utilises the company’s patented photonic debonding process. This process leverages high-intensity pulses of light in conjunction with their proprietary, reusable, light-absorbing layer carriers to debond temporarily bonded materials for wafer thinning, hybrid bonding, and micro-LED transfer.