OLED microdisplays researched and developed at the Dresden Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP have already been offered for several years as evaluation kits for potential exploitation partners. In addition to the design of application- and customer-specific microdisplay chips made possible by means of integrated circuit design, the industry-compatible, standardised manufacturing process technology development up to testing and characterisation methods plays an important role. For the latter, a 64-device microdisplay test unit for characterisation upon delivery or/and receipt of goods by customers will now be presented for the first time at embedded world 2023 (14-15 March in Nuremberg, Germany), at the Fraunhofer joint booth (Hall 4, No. 422).