As a global leader in material technologies Henkel (Düsseldorf, Germany) has launched a novel sensor experience kit tailor-made for IOT engineering across industries. The novel Henkel Qhesive Solutions Sensor INKxperience Kit offers four different printed electronics technologies that are pre-configured with hardware and software for prototyping and engineering ideation. The kit has been designed for professional engineers and enables them to quickly and efficiently explore and experiment with the technology of printed electronics for the development of IOT sensor solutions.



CERADROP (Limoges, France), a MGI Group company, supplied the Fraunhofer Institute for Ceramic Technologies and Systems IKTS with the Hybrid CeraPrinter F-Serie Platform. IKTS conducts applied research on high-performance ceramics and represents Europe‘s largest R&D institute dedicated to the study of the most complex ceramic devices.



OLED microdisplays researched and developed at the Dresden Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP have already been offered for several years as evaluation kits for potential exploitation partners. In addition to the design of application- and customer-specific microdisplay chips made possible by means of integrated circuit design, the industry-compatible, standardised manufacturing process technology development up to testing and characterisation methods plays an important role. For the latter, a 64-device microdisplay test unit for characterisation upon delivery or/and receipt of goods by customers will now be presented for the first time at embedded world 2023 (14-15 March in Nuremberg, Germany), at the Fraunhofer joint booth (Hall 4, No. 422).


Companies / Markets

TracXon, a spin-off of TNO at Holst Centre in Eindhoven, The Netherlands, specialising in the production of hybrid printed electronics, has opened a location in Eindhoven on 16 February, which is specially equipped for the mass production of hybrid printed electronics.


Exhibitions / Events

From 1 to 2 March 2023, LOPEC will once again open its doors at the ICM in Munich Messe. With over 180 conference papers, LOPEC is the world's leading communication platform for technology, solutions, knowledge and research in the printed electronics industry. InnovationLab (Heidelberg, Germany) will be exhibiting at booth B0.304.