The agreement enables both partners to deepen their joint R&D efforts in key areas such as next-generation patterning, advanced logic device processing, future memory development and 3D integration – all aimed at developing semiconductor nodes beyond 2nm.

The startup Botfellows, a spin-off from Fraunhofer IWU, will present its new solution for the first time at the automatica trade fair in Munich, Germany, from 24 to 27 June 2025.