The IDTechEx Printed Electronics Europe 2019 Awards were handed out in Berlin recently (photo: IDTechEx)

IDTechEx crowns winners of Printed Electronics Europe 2019 Award


Exhibitions / Events

At the 15th IDTechEx Printed Electronics Europe conference and exhibition in Berlin on 10-11 April, four companies were honoured for their great achievements in developing and commercialising printed electronics technologies. The judges of the awards were Dr Graham Anderson from BEKO, Dr Kiarash Vakhshouri from Google and Dr Adeline Koay from Diageo. The awards were presented by Dr Richard Collins of IDTechEx in Berlin on 10 April 2019. A summary of the awards and winners are as follows:

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An IMSE solution from TactoTek (photo: TactoTek)

Bö-La and TactoTek join forces for injection moulded structural electronics


Companies / Markets

Bö-La (Radevormwald, Germany) and TactoTek (Oulu, Finland) jointly announced that they have signed an agreement for BÖ-LA to market and sell injection moulded structural electronics (IMSE) solutions. This partnership brings together leaders in their respective technology domains to advance the market for integrating electronic functionality within moulded plastics.

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An application example of PragmatIC’s ConnectIC (photo: PragmatIC)

ConnectIC product launch: PragmatIC’s order book already exceeds 20M units


Products

PragmatIC (Cambridge,UK), a leader in ultra-low-cost flexible electronics, has announced that in just two months it has received orders for over 20 million flexible integrated circuits (FlexICs). Orders from customers in Europe, North America and Asia endorse PragmatIC’s unique technology platform as the ideal solution for introducing connectivity into mass market applications.

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DoMicro will showcase its solutions for printed and hybrid electronics at IDTechEx Show Berlin (photo: DoMicro)

Hybrid electronics integration by inkjet technology: DoMicro at IDTechEx Show Berlin


Exhibitions / Events

DoMicro BV from The Netherlands has progressed in advanced packaging and integration of conventional electronics in flexible foil structures. Printing multi-layers, passive components and interconnection of thinned silicon dies is enabled by revolutionary developments in nano-printing and specific inkjet technology.

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Coatema’s Test Solution S2S system (photo: Coatema)

Coatema showcases new Test Solution S2S system at IDTechEx Show


Exhibitions / Events

At the IDTechEx Show in Berlin (10-11 April 2019), Coatema Coating Machinery GmbH (Dormagen, Germany) presents its new Test Solution S2S system.

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