PACKAGING & SENSORS
Getting smart about packaging
Centre for Process Innovation (CPI) [Member of OE-A]
Light, flexible and bendable | ARMOR [Member of OE-A]
Sensor fusion | Interlink Electronics [Member of OE-A]
The flexible package for ultra-thin sensors and readout chips
IMS CHIPS (Institut für Mikroelektronik) [Member of OE-A]
Sensing solutions for intelligent packaging supporting circular economy and IoT
VTT Technical Research Centre [Member of OE-A]
Pushing past technology limits | Isorg [Member of OE-A]
Energy autonomy – let there be light!
Organic Electronic Technologies (OET) [Member of OE-A]
COMPONENTS
The Internet of Packaging | Luigi Bandera
Digital components and systems as equipment for Industry 4.0 processes
Erhardt+Leimer [Member of OE-A]
The future of smart packaging | PragmatIC [Member of OE-A]
Taking the next step | The Holst Centre [Member of OE-A]
Balancing the digital manufacturing equation with advanced subtractive laser technology
Universal Laser Systems
Beyond electrochromic displays | Ynvisible [Member of OE-A]
REREARCH / MATERIALS
Making smartphones and autonomous vehicles see the impossible
Imec [Member of OE-A]
Room for innovation | CYNORA [Member of OE-A]
EVENTS
Setting cornerstones for 2020 and beyond | innoLAE 2020
Printed electronics in every home | LOPEC 2020
MILDNER’S COLUMN
Smart Living – New focus topic at LOPEC 2020
BEYOND THE DESK
Snacking 4.0
SUPPLIERS DIRECTORY
Expanding Dimensions: 3D Structural Electronics
OE-A – European organization with global outreach
OE-A continues to bring the future of printed electronics to CES 2020
OE-A Calendar of Events
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