NEWS FROM OPE-JOURNAL.COM

PACKAGING & SENSORS
Getting smart about packaging
Centre for Process Innovation (CPI) [Member of OE-A]

Light, flexible and bendable | ARMOR [Member of OE-A]

Sensor fusion | Interlink Electronics [Member of OE-A]

The flexible package for ultra-thin sensors and readout chips
IMS CHIPS (Institut für Mikroelektronik) [Member of OE-A]

Sensing solutions for intelligent packaging supporting circular economy and IoT
VTT Technical Research Centre [Member of OE-A]

Pushing past technology limits | Isorg [Member of OE-A]

Energy autonomy – let there be light!
Organic Electronic Technologies (OET) [Member of OE-A]

COMPONENTS 
The Internet of Packaging | Luigi Bandera

Digital components and systems as equipment for Industry 4.0 processes
Erhardt+Leimer [Member of OE-A]

The future of smart packaging | PragmatIC [Member of OE-A]

Taking the next step | The Holst Centre [Member of OE-A]

Balancing the digital manufacturing equation with advanced subtractive laser technology
Universal Laser Systems

Beyond electrochromic displays | Ynvisible [Member of OE-A]

REREARCH / MATERIALS
Making smartphones and autonomous vehicles see the impossible
Imec [Member of OE-A]

Room for innovation | CYNORA [Member of OE-A]

EVENTS
Setting cornerstones for 2020 and beyond | innoLAE 2020

Printed electronics in every home | LOPEC 2020

MILDNER’S COLUMN
Smart Living – New focus topic at LOPEC 2020

BEYOND THE DESK
Snacking 4.0

SUPPLIERS DIRECTORY

Expanding Dimensions: 3D Structural Electronics

OE-A – European organization with global outreach

OE-A continues to bring the future of printed electronics to CES 2020

OE-A Calendar of Events

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