Packaging – tomorrow’s world
In an exclusive interview with OPE journal, Eef de Ferrante, director of the Active & Intelligent Packaging Industry Association, talks about intelligent packaging solutions and the role of printed electronics in this sector

A brain for bottles
Diageo and Thinfilm have teamed up to develop the connected ‘smart bottle’

A place for ideas
To enhance their R&D efforts, Stora Enso and NXP have launched a cooperation and will open a new Innovation Centre soon

Quad to profit with partners
Belgian-based Quad Industries supplies a wide range of touch and switch solutions for various industries. In an exclusive interview with OPE journal R&D director Wim Christiaens shares insights into the latest projects of his company

Glass that bends – and doesn’t break
New Era Converting Equipment thrusts home the market for flexible glass substrates

Towards higher stability
The combination of nanowire-based material and crystal micro fibrils is a promising replacement for the current ITO-standard, claims Charles Neuman, founder and president of Poly-Ink, in an interview with OPE journal

Holographic display revolution
The Fraunhofer FEP Institute has recently unveiled a coating that will help to realise the backlighting for the holographic displays of the future

Taking a leap into the future
This year’s Printed Electronics Europe trade show simply buzzed with activity as an international high-quality audience and numerous renowned exhibitors from our industry jostled to glimpse a multitude of new star products

Conference with everything
This year’s Plastic Electronics Conference focuses on the topic, ‘Enabling the Internet of Everything’ and brings together several renowned speakers from our industry

Printed electronics from PCBs to PCFs

Greek sportsmanship packs punch
A team of employees from the Greek packaging producer Hatzopoulos took on the ultimate challenge for amateur runners – participation in a marathon