News (smart packaging)

 
Smart packaging & IoT will be the main topics of the OE-A and EPSCRC event in Cambridge on 12 October (photo: OE-A)

OE-A and EPSRC to host “Printed Electronics Insights: Smart Packaging & IoT“ event in Cambridge

Together with the EPSRC Centre for Innovative Manufacturing in Large-Area Electronics / University of Cambridge, the OE-A (Organic Electronics Association) is organising “Printed Electronics Insights: Smart Packaging & IoT” – a day of presentations and a panel-discussion, co-sponsored by FlexTech.

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Packaging solutions with Bedford's ElastiTag now feature Thinfilm's NFC SpeedTap technology

Thinfilm and Bedford deliver smart hang-tag for NFC mobile marketing

Thin Film Electronics ASA (Oslo, Norway), a global leader in NFC smart-packaging solutions using printed electronics, announced a partnership with Bedford Industries (Worthington (MN), USA), an innovative manufacturer of product ties, closures and identification tags. The two companies will integrate Thinfilm’s NFC SpeedTap technology into Bedford’s popular ElastiTag hang-tag product line to deliver turnkey intelligent packaging solutions to consumer brand companies of all sizes as well as the broader fast moving consumer goods market.

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Smart packaging label for healthcare from E Ink, HTC and Palladio

E Ink, HTC and Palladio collaborate to develop smart packaging label

E Ink Holdings, a leading innovator of electronic ink technology, the direct patient care service provider of data science HTC Healthcare (both based in Taiwan) and the Italian pharmaceutical packaging company Palladio Group announced a collaboration to improve medication adherence by harnessing the healthcare segment of the Internet of Things (IoT).

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