News (flexible electronics)

 
Barrier films are the centrepiece in recent research at Fraunhofer IVV (photo: Fraunhofer IVV)

Permeation measurements are often a bottleneck for the development of high barrier films required for flexible electronic devices and vacuum insulation panels. The reasons are long measuring times, restricted measuring conditions and specific constants, such as sorption and diffusion coefficients, which cannot be easily read out from results.

 
CPI encourages companies to access new markets with printed electronics (photo: CPI)

The Centre for Process Innovation (CPI), a UK-based technology innovation provider for process manufacturing, presents itself as a key partner in supporting the latest phase of a project encouraging innovative companies to access new markets with printed electronics.

 
FlexLogIC’s intelligent automation enables high throughput manufacturing of flexible ICs (photo: PragmatIC)

PragmatIC (Cambridge, UK), a leader in ultra-low cost flexible electronics, recently announced that the first FlexLogIC “fab-in-a-box” has now been installed and commissioned in its facility at Sedgefield, UK.

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