News (flexible electronics)


Fraunhofer IZM: ECG with a patch – APPLAUSE European collaborative project successfully completed

Researchers from Fraunhofer IZM (Berlin, Germany), together with 31 partners from industry and research, have developed a stretchable and wireless patch that can be used to conduct diagnostically relevant cardiac monitoring in every-day life. This will reduce the number of in-patient examinations required for high-risk patients. It also boosts the semiconductor value chain for the medical sector in Europe through the development of new tools, methods and processes for series production.

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OE-A at IAA Mobility: Flexible and printed electronics drives sustainable mobility

The OE-A session “Flexible and Printed Electronics Drives Sustainable Mobility“ at the IAA Mobility Conference at Messe Munich (8 September, 3pm) is about how Printed Electronics enables endless design possibilities for the car interior. Thin, flexible and lightweight, printed electronics has the power to change the way you experience a car. Electric and autonomous vehicles have led us to new ways using and interacting with them. From today’s vehicle control centre to tomorrow’s leisure and entertainment lounge.

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Fraunhofer FEP – Paving the way for new ultra thin glass application

The processing of ultra-thin glass requires specialised handling to avoid glass breakage during production. Until now, this has been a major obstacle for the entry of this innovative material into new applications. Therefore, a unique process chain for ultra-thin glass processing has been implemented at Fraunhofer FEP (Dresden, Germany): starting with adapted cleaning processes up to the final inspection. The results have been funded within the project CUSTOM (grant no. AiF 21708 BR) by the German Federal Ministry of Economics and Climate Protection BMWK and the project Glass4Flex (grant no. 13N14615) funded by the German Federal Ministry of Education and Research BMBF.

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