News (flexible electronics)

 
Impressions from SEMICON Europa 2015 in Dresden (photo: Silicon Saxony)

2016FLEX Europe to present innovations in flexible, printed and hybrid electronics

The focus of the SEMICON Europa 2016 is materials and equipment for the semiconductor industry. The most significant European industry gathering will take place this year from 25 to 27 October in Grenoble, France. More than 400 exhibitors and 5500 visiting experts from all over the world are expected.

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BASF's improved composition of semiconductor inks opens up new possibilities in the manufacture of LCD and OLED screens on plastic substrates

BASF develops new semiconductor inks for printed electronics in LCD and OLED displays

Researchers at BASF SE, a globally active chemistry corporation based in Ludwigshafen, Germany, have succeeded in improving the composition of individual semiconductor ink components to double the mobility of the charge carriers in the printed circuits. This is expected to allow a further reduction of the structures in size and to produce high-resolution LCD or OLED screens on plastic substrates.

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The FlexCam metrology module from 4D Technology

4D Technology introduces FlexCam roughness and defect metrology module

The 4D Technology Corporation, a manufacturer of optical metrology systems based in Tucson (AZ), USA, has recently unveiled its new FlexCam metrology module. The new device is a compact, high-resolution 3D metrology system for in-situ roll-to-roll measurement of flexible electronics. FlexCam modules are reported to provide sub-nanometre vertical resolution and micrometre-scale lateral resolution for in-process roughness and defect quantification for the measurement of substrates, barrier films and intermediate layers.

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