News (flexible electronics)

Testing requirements for smart packaging: Ensuring quality, safety and functionality

Doro Mergner of MSWtech, Nuremberg, Germany, takes a look at the essential testing requirements that are critical when using flexible electronics in packaging.

LOPEC 2024: The Highlights for Flexible and Printed Electronics

Printed electronics is both a key and a cross-sectional technology, as this year's LOPEC will demonstrate with numerous applications and presentations. LOPEC takes place in Munich from March 5-7, 2024.

OE-A hosts its annual meeting in Munich before LOPEC 2024

One day before LOPEC, OE-A invites all its members to join the international working group within VDMA for an exciting meeting with outstanding invited talks and deep insights into the field of printed electronics at ICM Messe München.

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