The International Electrotechnical Commission (IEC) has published the first standard “63899-202-10: Printed Electronics – Materials – Resistance measurement on thermoformable conducting” providing the printed electronics industry a standardised way to characterise the material. Finnish Structural Electronics pioneer TactoTek has led the standard development project that is part of the Technical Committee (TC119) activities. First proposed by TactoTek, the development project initiated in 2019 has now resulted in this standard, which enables injection moulded structural electronics (IMSE) designers to create optimised designs with standardised materials.
The OE-A session “Flexible and Printed Electronics Drives Sustainable Mobility“ at the IAA Mobility Conference at Messe Munich (8 September, 3pm) is about how Printed Electronics enables endless design possibilities for the car interior. Thin, flexible and lightweight, printed electronics has the power to change the way you experience a car. Electric and autonomous vehicles have led us to new ways using and interacting with them. From today’s vehicle control centre to tomorrow’s leisure and entertainment lounge.
TactoTek (Oulu, Finland), a leading provider of in-mould structural electronics (IMSE) technology, has signed a recycling ecosystem partnership contract with Universal Recycling Technologies, LLC (North-America). As a part of TactoTek’s sustainability approach and the objective to develop more environmentally friendly electronics, TactoTek is building a global recycling ecosystem. This development promotes efficient recycling of manufacturing waste and IMSE end-of-life parts. The partnership enables TactoTek’s licensees to recycle IMSE production-related electronics waste in an efficient, environmentally friendly, and sustainable way. The recycling is done by the partner companies in the Recycling Ecosystem.
