News (Printed electronics)

The Future of Electronics RESHAPED: TechBlick hosts its first on-site event in the US

The new event will take place on 12-13 June, 2024, in Boston. 54 exhibitors and around 400 attendees are expected.

Pragmatic opens UK's first 300 mm semiconductor wafer manufacturing facility

Pragmatic Semiconductor has officially opened the UK’s first 300mm semiconductor wafer fabrication line (fab) at Pragmatic Park in Durham. The advanced manufacturing facility produces chips based on Pragmatic’s innovative and unique flexible integrated circuit technology.

Fraunhofer IPMS: Silicon chips for material characterization of printed electronics

How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS, Dresden (Germany) develops and manufactures silicon substrates for this purpose. This enables the fundamental electrical characterization of materials such as a novel graphene emulsion.

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