PulseForge, Inc. (Austin, Texas) has announced the launch of its latest product, the PD 300 SA semi-automated photonic debonding tool. Designed to enable semiconductor advanced packaging for R&D and low-volume customers, this cutting-edge tool utilises the company’s patented photonic debonding process. This process leverages high-intensity pulses of light in conjunction with their proprietary, reusable, light-absorbing layer carriers to debond temporarily bonded materials for wafer thinning, hybrid bonding, and micro-LED transfer.
Canatu (Vantaa, Finland) has recently expanded its patent portfolio with a new patent involving apparatuses and a method for oriented deposition. This invention enables them to orient carbon nanotubes horizontally, which enhances the electrical and mechanical properties of Canatu CNT films and its end applications, such as ADAS LiDAR film heaters for the automotive industry.
E Ink (Billerica, Massachusetts), global commercial leader in ePaper technology has showcased its comprehensive ePaper solutions at Touch Taiwan 2023 from 19-21 April. E Ink’s theme in 2023 was "We Make Surfaces Smart & Green," and the company presented its ePaper technology as the best display solution for low-carbon smart cities. E Ink showcased sustainable, innovative technologies and system reference designs that use fewer materials and consume less power. E Ink's ultra-low-power ePaper applications have been demonstrated in various sustainable smart city scenarios. Additionally, the company's full range of colour ePaper technology platforms has been unveiled.
