News (Printed electronics)

 
Impressions from previous innoLAE conferences (photo: EPSRC Centre for Innovative Manufacturing in Large-Area Electronics)

innoLAE 2018 call for papers is now open

The call for papers is now open for the Innovations in Large-Area Electronics (innoLAE) conference taking place 23-24 January 2018, at the Wellcome Genome Campus in Cambridge, UK. Large-Area Electronics (LAE) is a new way of making electronics and includes printed, flexible, plastic, organic, and bio- electronics.

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A smart moulded structure (photo: TactoTek)

Growing demand drives TactoTek expansion

Recently, TactoTek announced the opening of its new manufacturing and corporate headquarters facilities in Oulu, Finland, initiating a new phase of company growth. “In early 2016, TactoTek’s project pipeline began growing dramatically and foreshadowed additional production capacity requirements and staffing needs, so we started evaluating alternatives for larger facilities,” noted Jussi Harvela, CEO.

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Michael Ciesinski, president of FlexTech Alliance (photo: SEMI)

SEMI | FlexTech and CPEIA announce partnership at CPES 2017

The semiconductor industry association SEMI and its printed electronics strategic partner FlexTech have signed a memorandum of understanding with the Canadian Printable Electronics Industry Association CPEIA. The partners want to support each other’s programmes and drive the continued development and adoption of printable, flexible hybrid, and wearable electronics.

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