News (Printed electronics)

tesa opens new Debonding on Demand laboratory in Singapore

The new innovation hub will be established as a permanent location in tesa's technology network to drive customised development and scaling of removable adhesive solutions, particularly for customers in the automotive and electronics industries.

Avery Dennison to showcase future packaging innovations at Labelexpo

At the Barcelona trade fair, the company will highlight its latest advances in functional materials, RFID and NFC solutions.

Samsung Display’s foldable OLED panel passes 500,000-fold test

The remarkable durability stems from a newly developed shock-resistant structure, inspired by bulletproof glass.

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