News (Printed electronics)

 

tesa opens new Debonding on Demand laboratory in Singapore

The new innovation hub will be established as a permanent location in tesa's technology network to drive customised development and scaling of removable adhesive solutions, particularly for customers in the automotive and electronics industries.

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Avery Dennison to showcase future packaging innovations at Labelexpo

At the Barcelona trade fair, the company will highlight its latest advances in functional materials, RFID and NFC solutions.

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Samsung Display’s foldable OLED panel passes 500,000-fold test

The remarkable durability stems from a newly developed shock-resistant structure, inspired by bulletproof glass.

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