News (Printed electronics)

 
IMSE technology from TactoTek (photo: TactoTek)

LS Automotive Technologies licenses Tactotek’s IMSE technology

TactoTek (Oulu, Finland) and LS Automotive Technologies (LSAT) have signed a licensing agreement for the design and manufacturing rights of TactoTek’s injection moulded structural electronics (IMSE) technology. The agreement includes rights to use TactoTek’s intellectual property and a technology transfer that enables LSAT to design and manufacture IMSE parts in Korea and globally.

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A researcher at CPI (photo: CPI)

CPI celebrates 15 years of innovation

CPI, an independent technology innovation centre based in the UK, is celebrating 15 years of innovation across a range of different markets including pharmaceuticals, agritech, FMCG, automotive, energy and aerospace.

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Impressions from SEMICON Taiwan (photo: SEMI)

Brewer Science to share advanced packaging expertise at SEMICON Taiwan 2019

Brewer Science, Inc. (Rolla, Missouri) announced its participation at SEMICON Taiwan, the country’s largest annual microelectronics event, to be held 18-20 September 2019, at TWTC Nangang Exhibition Center in Taipei. In addition to showcasing its offerings in Booth N0262, Brewer Science is presenting at and sponsoring the SiP Global Summit 2019, a key programme on advanced packaging being held in conjunction with the conference.

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