News (Printed electronics)

 

Imec unites partners from the semiconductor value chain to jointly target net-zero emissions for chip manufacturing

This week, at Future Summits 2022, imec (Leuven, Belgium), a world-leading research and innovation centre in nanoelectronics and digital technologies, announces that its Sustainable Semiconductor Technologies and Systems (SSTS) research programme succeeded in bringing together stakeholders of the semiconductor value chain, from large system companies such as Apple and Microsoft, to suppliers, including ASM, Kurita, SCREEN and Tokyo Electron. The programme was set up last year as part of imec’s sustainability efforts to support the semiconductor industry reducing its carbon footprint. The addition of these new partners enables a holistic approach, which leverages imec’s expertise and knowledge to cut the industry’s environmental impact.

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POLYN Technology and Fraunhofer Mikroelektronik join forces for technological optimisation

POLYN Technology (Caesarea, Israel) and Fraunhofer Mikroelektronik will develop a special process optimisation as a part of POLYN’s next-generation Neuromorphic Analog Signal Processor (NASP) roadmap. The two companies’ project, accepted by the EU-funded ASCENT+ Consortium, enables access to key European infrastructures and helps academic and industry researchers address emerging challenges in nanoelectronics to accelerate innovation.

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Avery Dennison launches new dual frequency RFID inlays for retail and medical applications

Avery Dennison Corporation (Glendale, California) has launched two additions to its expanding Dual-frequency (DF) range of RFID inlays, which offer combined NFC (HF) and RAIN RFID (UHF) functionality for item-level tagging in a small, cost-effective way. The new AD Medio Web DF EM4425 and AD Web DF EM4425 V12 inlays and tags are designed for brand protection, supply chain management, and customer engagement.

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