For the tenth time OE-A organises the OE-A Competition for its members from all sectors of organic and printed electronics. Numerous international companies, research institutes and universities participate in the annual competition to present their new products, prototypes and concepts. Prizes will be awarded for the best submission in each of the three categories – "Prototypes & New Products"; "Freestyle Demonstrator"; and "Publicly Funded Project Demonstrator" at LOPEC 2020 in Munich, Germany the leading trade show and conference for printed electronics.
At LOPEC, the trade fair for printed electronics in Munich, the Fraunhofer Institute for Process Engineering and Packaging IVV will be demonstrating how 3D electronics can be manufactured using the roll-to-roll principle from 25-26 March 2020 in Hall B0, Stand 411. This is made possible by a new thermoforming process. It enables higher degrees of forming through temperature profiling. It was developed at the Processing Technology Division in Dresden.