News (Fraunhofer FEP)

 

Fraunhofer FEP: Joint project secureAR wins Technology Award

New technologies such as augmented reality (AR), artificial intelligence (AI) and cloud computing are rapidly opening up opportunities for entirely new business models and the future of work in industry. However, internet-based services also bring additional challenges in terms of data security and user acceptance. The German Federal Ministry of Education and Research is funding various interdisciplinary projects. At the closing conference, the joint project "secureAR" won the Technology Award with its open, cloud-based service platform and a new AR assistance system equipped with OLED microdisplays from Fraunhofer FEP (Dresden, Germany).

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Fraunhofer FEP: World record for OLED microdisplay

OLED microdisplays have so far been developed predominantly on 200mm wafers. These conventional CMOS technologies and the associated backplane design have limited the number and size of pixels until now. At the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Dresden, Germany), OLED microdisplays have been realised for the first time in a 28-nanometre backplane technology on 300mm wafers within the "Backplane" project funded by the Saxon State Ministry of Economics, Labour and Transport (SMWA).

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Fraunhofer FEP presents new thin-film measurement techniques for high-vacuum and high-temperature processes

In cooperation with SURAGUS GmbH, the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Dresden, Germany) has succeeded in realising non-contact in-situ measurements under high vacuum conditions at temperatures of up to 220°C within the HotSense project (grant number 100547507/4102) funded by the Saxon State Ministry of Economics, Labour and Transport (SMWA).

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