News (Conference and Exhibition)

Pragmatic opens UK's first 300 mm semiconductor wafer manufacturing facility

Pragmatic Semiconductor has officially opened the UK’s first 300mm semiconductor wafer fabrication line (fab) at Pragmatic Park in Durham. The advanced manufacturing facility produces chips based on Pragmatic’s innovative and unique flexible integrated circuit technology.

Fraunhofer IPMS: Silicon chips for material characterization of printed electronics

How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS, Dresden (Germany) develops and manufactures silicon substrates for this purpose. This enables the fundamental electrical characterization of materials such as a novel graphene emulsion.

OE-A: Strong Presence at drupa 2024

OE-A will exhibit at drupa, the world's leading fair for print and cross-media solutions. During the eleven event days from May 28 to June 7, 2024, OE-A will inform the international visitors and attendees about the broad range of application possibilities of the printed electronics technology. The focus will especially lie on smart packaging, technologies and applications.

Event diary

TechBlick Boston

The Future of Electronics RESHAPED

UMass Boston, USA

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