NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute (San Jose, California), announced it has successfully proven the robustness of the FHE manufacturing process, producing multiple functional samples of a flexible Arduino system. As part of the Flexible Arduino Microcontroller Project, NextFlex redesigned a device typically built on a rigid printed circuit board (PCB)—by printing and attaching thin bare die on a flexible substrate while maintaining the performance associated with traditional packaged ICs. This achievement is ultimately intended to help realise FHE’s enormous potential for creating ubiquitous IoT and sensor products for consumer, commercial, and military applications.