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DuPont Microcircuit and Components Materials collaborates with Kuprion Inc.

DuPont Microcircuit and Components Materials (MCM) business recently announced a strategic collaboration with Kuprion Inc. to launch the ActiveCopper thick film paste suite of products to the electronics industry.

Amcor announces strategic investment in PragmatIC Semiconductor

In its continuing efforts to discover and develop innovative technologies for the packaging industry, Amcor recently announced its strategic investment in PragmatIC Semiconductor (Cambridge, UK), a world leader in ultra, low-cost electronics.

TechBlick announces agenda for March event: Printed, Hybrid, InMold and 3D Electronics

TechBlick has published the agenda for its two-day conference and exhibition on Printed, Hybrid, InMold, and 3D Electronics. This event will take place LIVE (online) on 9-10 March 2022 in the interactive 'in-person virtual' space, making virtual interaction real and bringing together leading OEMs, manufacturers, material suppliers, and innovators.

Event diary

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