News ( ㉲ 레비트라 부작용 ㎋ ★───N▶《ｃｉａ１５8。ｎｅＴ ◀▒╋╋▒★★● ‰ 조루방지제구입약국 ㅝ 여성최음제100mg ㎪ 조루방지제구입하는곳 ☞ 스패니쉬플라이처방 ┤ 온라인 성기능개선제구입처 ㉧ 정품 시알리스 부작용‰ 정품미국비아그라 구입방법)

The OE-A at drupa 2024: Spotlight on smart packaging, technologies, applications

At drupa 2024 from May 28 to June 7 in Düsseldorf (Germany), the OE-A (Organic and Printed Electronics Association) informs visitors and attendees about the broad range of application possibilities of the printed electronics technology. The focus will especially lie on smart packaging as well as technologies and applications.

Rapidus and Fraunhofer IZM join forces for high-end performance packaging

Rapidus Corporation from Japan and Fraunhofer IZM from Germany aim to develop the most advanced node chip technology and a highly advanced packaging technology.

Imec with crucial role in EU Chips Act

Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, has announced at its technology forum ITF World 2024, that it will host the NanoIC pilot line. This pilot line taps into the EU Chips Act vision to accelerate innovation, drive economic growth and strengthen Europe’s semiconductor ecosystem.

Event diary

Currently there are no events.