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EV Group and Fraunhofer IZM-ASSID expand partnership in wafer bonding for quantum computing applications

The strategic partnership aims to develop and optimise alternative bonding and debonding technologies for advanced CMOS and heterogeneous integration applications, including quantum computing.

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Fraunhofer FEP: Innovative roll-to-roll plasma process for graphene layers

The Fraunhofer Institute for Electron Beam and Plasma Technology FEP from Dresden (Germany) has developed an innovative PECVD process that enables the deposition of graphene at high process speeds and offers higher production throughputs and a wider range of substrates at lower process temperatures.

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drupa 2024: "Record number of deals signed"

Organiser Messe Düsseldorf draws a very positive conclusion of drupa 2024, although the number of visitors was below the expected figure of 200,000.

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