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FlexEnable achieves "historic breakthrough" in flexible display technology

FlexEnable, a leader in the development and production of flexible organic electronics for active optics and displays, has announced that the world’s first mass-produced consumer product incorporating organic transistor technology has started shipping.

EV Group and Fraunhofer IZM-ASSID expand partnership in wafer bonding for quantum computing applications

The strategic partnership aims to develop and optimise alternative bonding and debonding technologies for advanced CMOS and heterogeneous integration applications, including quantum computing.

Fraunhofer FEP: Innovative roll-to-roll plasma process for graphene layers

The Fraunhofer Institute for Electron Beam and Plasma Technology FEP from Dresden (Germany) has developed an innovative PECVD process that enables the deposition of graphene at high process speeds and offers higher production throughputs and a wider range of substrates at lower process temperatures.

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