Leading research and technological development centres from across Europe came together in 2017 to develop an open-access pilot line for hybrid printed electronics. Initiated and coordinated by Holst Centre, the EU-funded InSCOPE project was set up with the aim of boosting industrial and commercial adoption of hybrid printed electronics (HPE) and maintain Europe's leading position in a rapidly growing market. Now, Holst Centre has announced that is has succeeded in setting up a consortium that hosts an open-access HPE pilot manufacturing line.
Toppan Printing (Tokyo, Japan), a global leader in communication, security, packaging, décor materials, and electronics solutions, recently launched Near cross D 2.9, an RFID tag with a battery-free display that can enhance traceability, enable labour-saving, and drive paperless processes in manufacturing, distribution, and retail.
CHASM Advanced Materials (Canton, Massachusetts) announced a strategic partnership with Henkel Adhesive Technologies (Düsseldorf, Germany), a global leading provider for adhesives, sealants and functional coatings. Henkel has certified and will carry one of CHASM’s Signis line of patented CNT inks under its LOCTITE brand. Specially formulated for superior optoelectronic performance and environmental robustness on a variety of flexible substrates, LOCTITE ECI 5006 E&C is screen printable for cost-effective transparent circuit production at high volumes.
