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Technology from Thinfilm (photo: Thinfilm)

BERICAP and Thinfilm partner to implement advanced closure technology

BERICAP (Budenheim, Germany), a supplier of world-class high value-added plastic caps and closures for food, beverage, pharmaceutical, and industrial markets, and Thin Film Electronics (San José, California), a leader in near field communications (NFC) solutions, have signed a letter of intent for an exclusive joint partnership to develop fully integrated digital authentication solutions for closures in over-the-counter pharmaceuticals and industrial applications.

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Lohmann was involved in the consortium project “Printed Electronics” that was showcased at the recent LOPEC tradeshow (photo: Lohmann)

Lohmann: Impetus for innovation at LOPEC

In March, LOPEC took place in Munich with about 160 international companies. They used the opportunity to present a full range of products and solutions for organic and printed electronics, from research to market launch. For Lohmann’s (Neuwied, Germany) bonding engineers, too, printed electronics is a promising market which offers innovative product possibilities. Consumer goods & electronics, transportation, medical, intelligent textiles and packaging are the main focuses of printed electronics – areas in which Lohmann has decades of experience.

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The IDTechEx Printed Electronics Europe 2019 Awards were handed out in Berlin recently (photo: IDTechEx)

IDTechEx crowns winners of Printed Electronics Europe 2019 Award

At the 15th IDTechEx Printed Electronics Europe conference and exhibition in Berlin on 10-11 April, four companies were honoured for their great achievements in developing and commercialising printed electronics technologies. The judges of the awards were Dr Graham Anderson from BEKO, Dr Kiarash Vakhshouri from Google and Dr Adeline Koay from Diageo. The awards were presented by Dr Richard Collins of IDTechEx in Berlin on 10 April 2019. A summary of the awards and winners are as follows:

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