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Flexible electronic devices from C3Nano (photo: C3Nano Inc.)

C3Nano’s ActiveGrid ink qualified for mass production by Hitachi Chemical Company

C3Nano Inc. (Hayward, California), a leader in silver nanowire-based transparent conductive inks and films used in flexible displays, touchscreens and other products, announced that Hitachi Chemical Company, Ltd. has qualified C3Nano’s ActiveGrid ink for mass production in its TCTF (transparent conductive transfer film) product. Additionally, Hitachi Chemical’s TCTF has been adopted in a major Chinese mobile flexible device and is expected to be integrated into several more flexible devices in 2019.

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A RAIN RFID label (photo: DELO)

DELO, Mühlbauer, and Impinj achieve milestone in efficient RAIN RFID label manufacturing

DELO Industrial Adhesives (Windach, Germany), Mühlbauer (Roding, Germany) and Impinj, Inc. (Seattle, Washington) have announced a new milestone in the effort to achieve high-volume inlay manufacturing. The three RAIN RFID industry leaders have successfully teamed to deliver DELO MONOPOX AC6545, supporting the high-speed assembly of copper-bonded RFID chips such as the Impinj Monza 6 family on Mühlbauer high speed assembly lines.

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An IMSE solution from TactoTek (photo: TactoTek)

Nagase to promote and distribute Tactotek’s IMSE technology in Japan

Recently, TactoTek announced that Nagase (Tokyo, Japan) signed an agreement to market and sell injection moulded structural electronics (IMSE) solutions in Japan. Nagase is one of Japan’s largest trading firms with a long history of introducing industry-leading products and technologies to the country’s commercial markets.

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