Brewer Science, Inc. (Rolla, Missouri) announced its participation at SEMICON Taiwan, the country’s largest annual microelectronics event, to be held 18-20 September 2019, at TWTC Nangang Exhibition Center in Taipei. In addition to showcasing its offerings in Booth N0262, Brewer Science is presenting at and sponsoring the SiP Global Summit 2019, a key programme on advanced packaging being held in conjunction with the conference.
Imec (Leuven, Belgium), a world-leading research and innovation hub in nanoelectronics and digital technologies, has opened the call for applicants (through 1 October 2019) for its globally-ranked business accelerator programme imec.istart. Start-up projects with technological inventiveness, an initial proof-of-concept, and the potential and ambition to be a global company are encouraged to apply.
The Integrated Interior Platform is the basis for the human-machine interaction of the future: depending on the driving mode, it turns the cockpit into an information centre or a rolling living room with large displays (photo: Continental)
At the IAA 2019 in Frankfurt (12 to 22 September), Continental has unveiled the latest version of its Integrated Interior Platform (IIP). As a high-performance computer, this comprehensive solution for software and hardware provides the basis for interaction between humans and vehicles in the connected cockpit of tomorrow – and at the highest level of quality. In its cockpit demonstrator, the technology company showed how the IIP combines various displays, such as the instrument cluster and the centre console display, with Internet-based services to form a complete solution. The IIP is a milestone in the E/E architecture revolution, which is seeing in-car electronics move away from many individual control units to a few high-performance computers.
