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Mark Majewski, intelliFLEX CEO (photo: intelliFLEX)

intelliFLEX appoints new CEO

The intelliFLEX Innovation Alliance announced that Mark Majewski, a 30-year veteran of the Canadian technology industry and former geographic director at a major semiconductor company, has succeeded Peter Kallai as CEO. Majewski has extensive experience in the electronics and technology industries in Canada, having overseen the generation of hundreds of millions of dollars at STMicroelectronics while running its East Central U.S. and Canada regions.

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Fraunhofer FEP’s OLED on silicon sensor (photo: Fraunhofer FEP)

Fraunhofer FEP: Blue OLED on silicon sensor detects phosphorescence

The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Dresden, Germany) has been involved in development of OLED-on-silicon sensors for years. The researchers have recently developed a miniaturised phosphorescence sensor that combines a marker and sensor on very small chip surface that could be produced at low cost in the long term. Researchers will present the first prototype of the sensor, which is currently designed for oxygen ratio monitoring, at embedded world 2019, 26-28 February in Nuremberg, Germany.

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Diamond Packaging’s NFC calendar (photo: Diamond Packaging)

Diamond Packaging debuts corporate calendar featuring NFC Smart Tag technology

Diamond Packaging (Rochester, New York) recently announced the debut of its 2019 corporate calendar, a popular promotional item given to customers and suppliers. It is also the company’s first to feature NFC smart tag technology, which enables brands to connect directly with consumers.

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