Canatu (Vantaa, Finland), a leader in advanced CNT for automotive and semiconductor industries, announced the closing of a €18M funding round, led by long-standing investors 3M Ventures, the venture capital arm of 3M, Ascend and eFruit International Inc. New investors to Canatu also included Minth Group Ltd., Nordea, and Varma. With this latest funding round, the company has raised a total of €74M in financing since 2008.
Avery Dennison’s (Mentor, Ohio) atma.io connected product cloud joins the CIRPASS consortium, bringing together a core network of leading organisations in building the European vision for a unified Digital Product Passport (DPP) approach across multiple value chains. Funded by the European Commission under the Digital Europe Programme, CIRPASS aims to prepare the ground for the gradual piloting and deployment of the DPPs from 2023 onwards, with an initial focus on the electronics, batteries and textile sectors.
The In-Mould Structural Electronics (IMSE) pioneer TactoTek (Oulu, Finland), recently announced three new products at its industry leader conference IMSE Days 4.0. The products are expected to enhance the company’s capability to address the growing demand for creating differentiating smart surfaces in the market place, manufactured in a sustainable manner. Karthikesh Raju, SVP for product management and marketing at TactoTek, says: “For our customers, the enhanced usability of TactoTek’s products and services will help scale the design, manufacturing and delivery of the solutions in the swiftly evolving market place.”
