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The OE-A at drupa 2024: Spotlight on smart packaging, technologies, applications

At drupa 2024 from May 28 to June 7 in Düsseldorf (Germany), the OE-A (Organic and Printed Electronics Association) informs visitors and attendees about the broad range of application possibilities of the printed electronics technology. The focus will especially lie on smart packaging as well as technologies and applications.

Rapidus and Fraunhofer IZM join forces for high-end performance packaging

Rapidus Corporation from Japan and Fraunhofer IZM from Germany aim to develop the most advanced node chip technology and a highly advanced packaging technology.

Imec with crucial role in EU Chips Act

Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, has announced at its technology forum ITF World 2024, that it will host the NanoIC pilot line. This pilot line taps into the EU Chips Act vision to accelerate innovation, drive economic growth and strengthen Europe’s semiconductor ecosystem.

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