Together with the EPSRC Centre for Innovative Manufacturing in Large-Area Electronics / University of Cambridge, the OE-A (Organic Electronics Association) is organising “Printed Electronics Insights: Smart Packaging & IoT” – a day of presentations and a panel-discussion, co-sponsored by FlexTech.
CERADROP (Limoges, France), a MGI Group company which designs and markets materials deposition digital printers exclusively for printed electronics and smart 3D printing, has announced that the University of Texas at San Antonio (UTSA) will strengthen its multifunctional electronic materials and devices research with the acquisition of a CERADROP Hybrid 3D Digital Deposition platform.
The digital hybrid company TOPPAN FORMS Co., Ltd. (Tokyo, Japan) has developed a technology for forming printed micro wires, which enables a wire width of 4μm that is almost invisible to the naked eye. The company has established this technology by combining a conductive ink for micro wiring (silver salt ink) and a corresponding printing process technology. The new technology can be used for transparent electrodes for touch sensor panels, wearable sensors, sensors for the Internet of Things (IoT), and similar devices.
