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Rapidus and Fraunhofer IZM join forces for high-end performance packaging

Rapidus Corporation from Japan and Fraunhofer IZM from Germany aim to develop the most advanced node chip technology and a highly advanced packaging technology.

 

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Imec with crucial role in EU Chips Act

Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, has announced at its technology forum ITF World 2024, that it will host the NanoIC pilot line. This pilot line taps into the EU Chips Act vision to accelerate innovation, drive economic growth and strengthen Europe’s semiconductor ecosystem.

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Wiliot introduces new ambient IoT food safety initiative

Underscoring its commitment to set a new benchmark for food safety, Wiliot, the ambient Internet of Things (IoT) pioneer, has announced a major new food safety initiative that works to create completely transparent and traceable supply chains – soon required for FSMA 204 compliance – through the adoption of ambient IoT technology.

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