Recently, TactoTek announced that Nagase (Tokyo, Japan) signed an agreement to market and sell injection moulded structural electronics (IMSE) solutions in Japan. Nagase is one of Japan’s largest trading firms with a long history of introducing industry-leading products and technologies to the country’s commercial markets.
BERICAP (Budenheim, Germany), a supplier of world-class high value-added plastic caps and closures for food, beverage, pharmaceutical, and industrial markets, and Thin Film Electronics (San José, California), a leader in near field communications (NFC) solutions, have signed a letter of intent for an exclusive joint partnership to develop fully integrated digital authentication solutions for closures in over-the-counter pharmaceuticals and industrial applications.
In March, LOPEC took place in Munich with about 160 international companies. They used the opportunity to present a full range of products and solutions for organic and printed electronics, from research to market launch. For Lohmann’s (Neuwied, Germany) bonding engineers, too, printed electronics is a promising market which offers innovative product possibilities. Consumer goods & electronics, transportation, medical, intelligent textiles and packaging are the main focuses of printed electronics – areas in which Lohmann has decades of experience.
