The global consulting firm Frost & Sullivan announced that TactoTek from Oulu, Finland, has received its 2017 Best Practices Award for 3D injection moulded structural electronics technology innovation.
The global market for intelligent packaging with printed electronic components is growing rapidly. Messe München is focusing on this topic with two events: drinktec, the world’s leading trade fair for the beverage and liquid food industry, will take place from 11 to 15 September 2017. The drinktec Forum on 14 September will provide information about printed electronics applications in the beverage industry. LOPEC, the international exhibition and conference for the printed electronics industry, will then take place six months later from 13 to 15 March 2018 and will focus, among other things, on smart packaging.
To continue LOPEC’s successful printed electronics Conference Programme and to keep on the high level of extensive and informative presentations on the current state of the art, the organisers of LOPEC again offer the opportunity to make contributions for a fruitful LOPEC 2018. This time the focus topics will be Medical & Wellbeing and Automotive & Vehicle.
