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TactoTek: International Electrotechnical Commission (IEC) publishes first standard on in-mould electronics

The International Electrotechnical Commission (IEC)  has published the first standard “63899-202-10: Printed Electronics – Materials – Resistance measurement on thermoformable conducting” providing the printed electronics industry a standardised way to characterise the material. Finnish Structural Electronics pioneer TactoTek has led the standard development project that is part of the Technical Committee (TC119) activities. First proposed by TactoTek, the development project initiated in 2019 has now resulted in this standard, which enables injection moulded structural electronics (IMSE) designers to create optimised designs with standardised materials.

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Fraunhofer FEP: Microdisplays for transfer to the Saxon industry

Within the project “Backplane”, funded by the Saxon State Ministry of Economics, Labour and Transport SMWA (grant number: 100392259), a multicolour OLED microdisplay was realised by scientists of the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Dresden, Germany). With the Saxon project partner digades GmbH, a finished optics module should be brought to market in the future.

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CES 2024 poised for growth

The Consumer Technology Association (CTA) recently announced today that CES 2024 is thriving and on track to surpass the CES 2023 footprint and number of attendees, exhibitors and global media. CES 2024 will be the largest in-person, independently audited tech event in the world. Scheduled 9-12 January in Las Vegas, registration for CES 2024 is now open.

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