TactoTek (Oulu, Finland), a leading developer of injection moulded structural electronics (IMSE) solutions, announced that it has closed $23M in funding. The investment round attracted new strategic investors, Ascend Capital Partners, Nanogate, and Plastic Omnium, continuing participation from prior investors, including Conor Venture Partners and Faurecia Ventures, as well as debt instruments and grants.
On 13 February, the 2018 FLEXI Awards recognised groundbreaking accomplishments in the Flexible Hybrid Electronics (FHE) sector in the last year. Presented at the opening session of the 17th annual 2018FLEX Conference and Exhibition, in Monterey, California, the awards spotlighted the following leaders in the categories of R&D Achievements, Product Innovation and Commercialisation, Education Leadership and Industry Leadership.
NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute (San Jose, California), announced it has successfully proven the robustness of the FHE manufacturing process, producing multiple functional samples of a flexible Arduino system. As part of the Flexible Arduino Microcontroller Project, NextFlex redesigned a device typically built on a rigid printed circuit board (PCB)—by printing and attaching thin bare die on a flexible substrate while maintaining the performance associated with traditional packaged ICs. This achievement is ultimately intended to help realise FHE’s enormous potential for creating ubiquitous IoT and sensor products for consumer, commercial, and military applications.
