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Dr Klaus Hecker, OE-A: "Sustainability is a key driver in printed electronics"

On the occasion of drupa 2024, Dr Klaus Hecker, Managing Director of OE-A, a working group within VDMA, speaks about the trade fair and its significance for the printed electronics industry.

The OE-A at drupa 2024: Spotlight on smart packaging, technologies, applications

At drupa 2024 from May 28 to June 7 in Düsseldorf (Germany), the OE-A (Organic and Printed Electronics Association) informs visitors and attendees about the broad range of application possibilities of the printed electronics technology. The focus will especially lie on smart packaging as well as technologies and applications.

Rapidus and Fraunhofer IZM join forces for high-end performance packaging

Rapidus Corporation from Japan and Fraunhofer IZM from Germany aim to develop the most advanced node chip technology and a highly advanced packaging technology.

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