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Direct printing of complex 3D moulded interconnect devices from Neotech AMT offer many advantages (photo: Neotech AMT)

LOPEC 2018: 3D-printed circuits and more

Printed electronics and 3D-printing systems are coming together and enabling new applications. The current state of this technology and its potential are a hot topic at LOPEC, the international exhibition and conference for the printed-electronics industry, which will be held from 13 to 15March 2018, at the Messe München exhibition grounds (Munich, Germany).

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Data glasses with OLED microdisplays (photo: Fraunhofer FEP)

Fraunhofer FEP unveils demonstrator for multifunction data glasses with OLED microdisplays

Bidirectional OLED microdisplays developed at Fraunhofer FEP were successfully integrated for the first time into a demonstrator of data glasses for representing augmented and virtual realties (AR and VR) as well as 2D and 3D content.

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Imec’s CMOS-compatible NeuroSeeker high-density neural probe (photo: Imec)

Imec creates innovative neural probe demonstrator

Imec, a leading research and innovation hub in nanoelectronics and digital technologies from Leuven, Belgium, announced at its Imec Technology Forum (ITF) health event, that is has designed and fabricated a demonstrator of a neural probe with unprecedented electrode density within the framework Neuroseeker, a large-scale EU-project. Designed and fabricated in silicon chip technology, the probe is suitable for breakthrough bio-interfaces and implants that are expected to shape the future of neuroscience. With hundreds of electrodes capable of contacting and reading out single neurons, this probe incorporates innovations that point the way to a better understanding of the brain, and ultimately will lead to diagnostic and prosthetic tools to tackle human brain diseases.

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