Evonik Industries AG from Essen, Germany, a leading producer of specialty chemicals, and Holst Centre, an independent R&D centre for flexible electronics in Eindhoven, The Netherlands, have entered the next phase of their cooperation. Over the last two years, the partners have optimised the materials and processes of the new semiconductor technology iXsenic S. Now, the revolutionary technology has been introduced into mass production.
A recent industry-led design project by Brunel University London has produced a range of innovative packaging concepts with incorporated printed electronics elements. Crown Packaging, a leading manufacturer of metal packaging with headquarters in Philadelphia (PA), USA, has teamed up with The Centre for Process Innovation (CPI), a UK-based technology innovation centre, in order to set a challenge to 36 postgraduate design, innovation and branding students from Brunel University.
Sensory Analytics, LLC, a provider of advanced coating and film measurement solutions with headquarters in Greensboro (NC), USA, has received the coveted C2 Asia/ICE daily Innovation Award 2014 at the recently concluded ICE Asia trade fair in Shanghai, China.
