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Holst Centre shows next step towards cheaper flexible electronics

Researchers from Holst Centre (Eindhoven, The Netherlands) have become the first to use spatial atomic layer deposition (sALD) to create both the semiconductor and dielectric layer in a thin-film transistor (TFT) backplane. Using a low-temperature, large-area process for the backplane, the team created a 200 ppi QVGA display demonstrator. The process allows TFTs to be produced on cheaper, transparent plastic foils, significantly reducing the cost of flexible electronics applications such as displays and image sensors. To showcase the technology, Holst Centre has produced a display demonstrator using a backplane of top-gated self-aligned TFTs on a PEN foil.

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Jabil was honoured for its community support and charitable work in the Tampa Bay area – and its aim to raise awareness to cardiovascular diseases (photo: pixabay.com)

Jabil recognised as philanthropic corporation of the year

Jabil (St. Petersburg, Florida) recently received recognition as Philanthropic Corporation of the Year by the Tampa Bay chapter of the Association of Fundraising Professionals (AFP). Johns Hopkins All Children’s Foundation and the American Heart Association nominated Jabil for the philanthropic work that the global manufacturing company does in the Tampa Bay community.

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innoLAE 2019 welcomed hundreds of international attendees – next year’s event promises a similar success (photo: EPSRC Centre for Innovative Manufacturing in Large-Area Electronics)

innoLAE 2020: Setting cornerstones for 2020 and beyond

The 6th annual Innovations in Large-Area Electronics Conference (innoLAE 2020; 21-22 January 2020) highlights innovative and exciting aspects of large-area electronics – a new way of making electronics, leveraging novel processes and new functional materials to provide electronic functionality in thin, flexible and transparent designs. The conference encompasses printable, plastic, organic, flexible and bio- electronics with topics including high performance materials, advances in devices and systems, novel manufacturing processes and hybrid integration with silicon electronics.

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