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DELO: New semicon adhesive propels autonomous driving forward

DELO (Windach, Germany) has developed a flexible electronics adhesive that permanently seals sensor housings airtight and thus reliably protects components such as image sensors. DELO DUALBOND BS3770 meets the stringent requirements of the semiconductor and automotive industries and helps drive innovation in autonomous driving.

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Celanese and TracXon announce collaboration on large area LED-on-foil

Celanese Micromax Electronic Inks and Pastes (Irving, Texas) announced a collaboration with TracXon (Eindhoven, The Netherlands), a fully-integrated foundry for printed electronics, to bring large area LED-on-foil to the automotive and consumer electronics markets. The uniqueness of the large area LEDs is not only its size capability, measuring in at 1.8 metres by 0.5 metres, but also the flexibility of the foil and the fine line resolution circuitry.

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Fraunhofer IZM: ECG with a patch – APPLAUSE European collaborative project successfully completed

Researchers from Fraunhofer IZM (Berlin, Germany), together with 31 partners from industry and research, have developed a stretchable and wireless patch that can be used to conduct diagnostically relevant cardiac monitoring in every-day life. This will reduce the number of in-patient examinations required for high-risk patients. It also boosts the semiconductor value chain for the medical sector in Europe through the development of new tools, methods and processes for series production.

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