DELO Industrial Adhesives (Windach, Germany), Mühlbauer (Roding, Germany) and Impinj, Inc. (Seattle, Washington) have announced a new milestone in the effort to achieve high-volume inlay manufacturing. The three RAIN RFID industry leaders have successfully teamed to deliver DELO MONOPOX AC6545, supporting the high-speed assembly of copper-bonded RFID chips such as the Impinj Monza 6 family on Mühlbauer high speed assembly lines.
Recently, TactoTek announced that Nagase (Tokyo, Japan) signed an agreement to market and sell injection moulded structural electronics (IMSE) solutions in Japan. Nagase is one of Japan’s largest trading firms with a long history of introducing industry-leading products and technologies to the country’s commercial markets.
BERICAP (Budenheim, Germany), a supplier of world-class high value-added plastic caps and closures for food, beverage, pharmaceutical, and industrial markets, and Thin Film Electronics (San José, California), a leader in near field communications (NFC) solutions, have signed a letter of intent for an exclusive joint partnership to develop fully integrated digital authentication solutions for closures in over-the-counter pharmaceuticals and industrial applications.
