Bö-La (Radevormwald, Germany) and TactoTek (Oulu, Finland) jointly announced that they have signed an agreement for BÖ-LA to market and sell injection moulded structural electronics (IMSE) solutions. This partnership brings together leaders in their respective technology domains to advance the market for integrating electronic functionality within moulded plastics.
PragmatIC (Cambridge,UK), a leader in ultra-low-cost flexible electronics, has announced that in just two months it has received orders for over 20 million flexible integrated circuits (FlexICs). Orders from customers in Europe, North America and Asia endorse PragmatIC’s unique technology platform as the ideal solution for introducing connectivity into mass market applications.
DoMicro BV from The Netherlands has progressed in advanced packaging and integration of conventional electronics in flexible foil structures. Printing multi-layers, passive components and interconnection of thinned silicon dies is enabled by revolutionary developments in nano-printing and specific inkjet technology.
