NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute (San Jose, California), announced it has successfully proven the robustness of the FHE manufacturing process, producing multiple functional samples of a flexible Arduino system. As part of the Flexible Arduino Microcontroller Project, NextFlex redesigned a device typically built on a rigid printed circuit board (PCB)—by printing and attaching thin bare die on a flexible substrate while maintaining the performance associated with traditional packaged ICs. This achievement is ultimately intended to help realise FHE’s enormous potential for creating ubiquitous IoT and sensor products for consumer, commercial, and military applications.
Thin Film Electronics ASA (Oslo, Norway), a global leader in NFC (near field communication) mobile marketing and smart packaging solutions, recently announced that John McNulty has joined the organisation as EVP marketing. The company also announced the promotion of Christian Delay to EVP software.
The year 2018 will be a milestone for Novaled in the company's history, because the move to the new premises in Dresden, Germany, will be kicked off in the second half of the year. On the 10 200m² plot, the interior construction of the buildings is currently in full swing. The monument protected historic mill with prestigious office space and the R&D plant with research areas, clean rooms of classes ISO5 and ISO7 as well as laboratories have a combined floor area of 6160m².
